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WSAL17219 – MLX90640-D110 Thermal Camera/en

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Documentation notice: This technical documentation was independently rewritten from an archived supplier source. Check technical details and commands against the product version and manufacturer documentation before use.

Summary

The MLX90640-D110 is an IR-array thermal imaging camera with a 32×24 pixel resolution (768 sensors) and a 110°×75° field of view. It communicates via I²C (address 0x33), operates at 3.3 V or 5 V, and supports refresh rates from 0.5 Hz to 64 Hz.

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Technical overview

  • Resolution: 32 columns × 24 rows = 768 infrared sensors; each pixel is designated Pixel(i,j), where i=row (1–24), j=column (1–32).
  • Field of view for the D110 model: 110° horizontal × 75° vertical (wide-angle, suited to short-range measurement).
  • Interface: I²C, default address 0x33; high-speed mode up to 1 MHz; the module can only operate as a slave on the bus.
  • Supply voltage: 3.3 V or 5 V; the onboard level shifter allows direct connection to a 5 V I²C bus without external pull-up resistors.
  • Operating current: less than 23 mA.
  • Temperature range: ambient −40 °C to +85 °C; target measurement range −40 °C to +300 °C; resolution ±1 °C.
  • Refresh rates: programmable from 0.5 Hz to 64 Hz; controlled via Control Register 1 (0x800D) using bits 7–9; two update modes (Chess pattern, factory default; TV interleave), selectable via bit 12 of the same register.
  • Dimensions: 28 mm × 16 mm; mounting hole diameter 2.0 mm.
  • NETD (noise-equivalent temperature difference): 0.1 K RMS at 1 Hz refresh rate.
  • Application examples: non-contact object temperature detection, IR thermometer, smart home/building/lighting, industrial temperature control, intrusion/motion detection.

Notes and version constraints

  • The source text contains no explicit command lines or CLI commands; the example sections (Raspberry Pi, STM32, ESP32) describe hardware connections and IDE steps, but no concrete commands were reproduced.
  • Exact pin assignments vary by host platform (e.g., Raspberry Pi, STM32F405R, ESP32); correct mapping must be verified per platform against the original documentation.
  • The datasheet permits up to 4 defective pixels out of the factory; these are marked in the EEPROM table. The presence of defective pixels cannot be used as grounds for return or exchange; using the average of adjacent pixels is recommended.
  • During operation, avoid excessive vibration and hot-plugging, as the onboard EEPROM can be damaged by shock. Overly long communication cables may cause EEPROM write errors.
  • The temperature measured within the field of view is a weighted average of all detected surfaces; for higher accuracy, the object should lie entirely within the FOV.
  • The exact distance-to-FOV formula is referenced in the original as a figure; independent calculation requires access to the Melexis datasheet.
  • Version sensitivity: register values (e.g., 0x800D) and address assignments may differ across firmware versions; verify against current documentation before implementation.
  • No prices, stock levels, certifications, or warranty terms were present in the source; such details must not be added here.

Source and revision record

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